Nanofab Equipement

• writemode I 2 mm with 0.7 µm resolution (write field 3″)
• writemode II 4 mm with 1 µm resolution (write field 4″)

Heidelberg µpg101 Laser Writer

The Heidelberg µPG101 is a direct writing lithography (DWL) system with two writing modes

• chromium mask or soft plastic film up to 4″
• microscope objectives : X10 et X20

Süss MJB3 mask aligner

MJB3 mask aligner is dedicated to lab work (master students) and to the processes based on SU8 resist (ex. microfluidic). Key features

Different contact modes are available :

• proximity
• soft contact
• hard contact
• vacuum chamber

Süss MJB4 mask aligner

MJB4 mask aligner handle 4″ and 5″ masks. The size of the sample goes from 10×10 mm² up to 4″. The precision of the alignment is ±1µm and the microscope (linked to a camera) is equipped with x10 and x20 objective lenses.

key features :

• Schottky Thermal field emission type
• Gemini Column
• Resolution: 1 nm at 20 keV
• working distance: 2 mm
• Acceleration voltage: 0,1 to 30 keV
• Probe current: 20 pA à 20 nA
• Stage repeatability:  1 µm
• pattern generator: 6 MHz / 16 bits

Zeiss Supra 40 + Raith elphy plus

Ebeam lithography is composed by a  Zeiss Supra 40 FESEM coupled with Raith Elphy Plus software.

The planetary sample holder is able to tilt from 0° to 270 ° and/or rotate during deposition.

Plassys MEB550S

E-beam evaporator for metallic thin films (Al, Au, Co, Cr, Ni, NiFe, Ti).

The load-lock is equipped with an argon ion gun for cleaning the samples.

The sample holder can be cool down with liquid nitrogen (77K) and tilted (0 – 90°)

Plassys MEB 300

Thermal Evaporator for metallic thin films (Cr, Al, Au, Ag).

The sample can be heated up to 250°C with an halogen lamp

Plassys MEB 400

E-beam Evaporator for non standard deposition (ex. CoFe).

The system is equipped with an ion gun (Ar, O₂).

Edwards Auto 306

Thermal Evaporator for exotic materials (metal, organic)

key features :

• back side Helium cooling (thermal contact)
• laser interferometry
• size of sample up to 100 mm

Reactive Ion Etching

Plasmalab 80 plus (OIPT) : Reactive Ion Etching system with ICP source (RIE-ICP).

Etched materials: Si, Si₃N₄, SiO₂, Quartz, Polymers

Gaz disponibles : Ar, He, CHF₃, SF₆, O₂, CF₄

• Hydrofluoric Acid (HF)
  • SiO2 etching
•  Piranha:  sulfuric acid (H₂SO₄) + hydrogen peroxide  ( H₂O₂)
  • mask cleaning

Acid Etching

(Ask a staff member for these processes)

Wire bonding

Hybond 626 semi-automatic gold wire bonder (wedge and ball bonding).

Scriber

Scriber for silicon wafers

• C-AFM : Conductive AFM
• PFM : Piezoreponse
• MFM : Magnetic Force Microscope
• nanolitho

Atomic Force Microscopy (AFM)

Atomic Force Microscope (Bruker Dimension Edge)..

Optical Microscopy

Different microscopes are available to users for qualitative monitoring processes (like the Zeiss Axio Imager microscope equipped with a X100 lens)