Booking System :
Lithography :
UV Lithography
![](https://www.ipcms.fr/wp-content/uploads/2021/01/HIMT_PG101-300x225-1.jpg)
- writemode I 2 mm with 0.7 µm resolution (write field 3″)
- writemode II 4 mm with 1 µm resolution (write field 4″)
Heidelberg µpg101 Laser Writer
The Heidelberg µPG101 is a direct writing lithography (DWL) system with two writing modes
![](https://www.ipcms.fr/wp-content/uploads/2021/01/aligneur2-300x225-1.jpg)
- chromium mask or soft plastic film up to 4″
- microscope objectives : X10 et X20
Süss MJB3 mask aligner
MJB3 mask aligner is dedicated to lab work (master students) and to the processes based on SU8 resist (ex. microfluidic). Key features
![](https://www.ipcms.fr/wp-content/uploads/2021/01/aligneur-300x225-1.jpg)
Different contact modes are available :
- proximity
- soft contact
- hard contact
- vacuum chamber
Süss MJB4 mask aligner
MJB4 mask aligner handle 4″ and 5″ masks. The size of the sample goes from 10×10 mm² up to 4″. The precision of the alignment is ±1µm and the microscope (linked to a camera) is equipped with x10 and x20 objective lenses.
Ebeam Lithography
![](https://www.ipcms.fr/wp-content/uploads/2021/01/zeiss40-300x225-1.jpg)
key features :
- Schottky Thermal field emission type
- Gemini Column
- Resolution: 1 nm at 20 keV
- working distance: 2 mm
- Acceleration voltage: 0,1 to 30 keV
- Probe current: 20 pA à 20 nA
- Stage repeatability: 1 µm
- pattern generator: 6 MHz / 16 bits
Zeiss Supra 40 + Raith elphy plus
Ebeam lithography is composed by a Zeiss Supra 40 FESEM coupled with Raith Elphy Plus software.
Thin Films :
Evaporation
![](https://www.ipcms.fr/wp-content/uploads/2021/01/depot.jpg)
The planetary sample holder is able to tilt from 0° to 270 ° and/or rotate during deposition.
Plassys MEB550S
E-beam evaporator for metallic thin films (Al, Au, Co, Cr, Ni, NiFe, Ti).
The load-lock is equipped with an argon ion gun for cleaning the samples.
![](https://www.ipcms.fr/wp-content/uploads/2021/01/evaporateur2-294x300-1.jpg)
The sample holder can be cool down with liquid nitrogen (77K) and tilted (0 – 90°)
Plassys MEB 300
Thermal Evaporator for metallic thin films (Cr, Al, Au, Ag).
Pulverisation cathodique
![](https://www.ipcms.fr/wp-content/uploads/2021/01/ebeam-229x300-1.jpg)
The sample can be heated up to 250°C with an halogen lamp
Plassys MEB 400
E-beam Evaporator for non standard deposition (ex. CoFe).
The system is equipped with an ion gun (Ar, O2).
![](https://www.ipcms.fr/wp-content/uploads/2021/01/evaporateur-225x300-1.jpg)
Edwards Auto 306
Thermal Evaporator for exotic materials (metal, organic)
![](https://www.ipcms.fr/wp-content/uploads/2021/01/sputt_human-300x200-1.jpg)
Alliance Concept EVA300+
Sputtering system with 3″ RF & DC magnetrons)
Targets : ITO, SiO2, Si3N4, Si
gases : Ar, N2, O2
size of subtrate: up to 4
Etching :
Dry Etching
![](https://www.ipcms.fr/wp-content/uploads/2021/01/gravure-300x199-1.jpg)
key features :
- back side Helium cooling (thermal contact)
- laser interferometry
- size of sample up to 100 mm
Reactive Ion Etching
Plasmalab 80 plus (OIPT) : Reactive Ion Etching system with ICP source (RIE-ICP).
Etched materials: Si, Si3N4, SiO2, Quartz, Polymers
Gaz disponibles : Ar, He, CHF3, SF6, O2, CF4
Wet Etching
![](https://www.ipcms.fr/wp-content/uploads/2021/01/paillasse-300x200-1.jpg)
- Hydrofluoric Acid (HF)
- SiO2 etching
- Piranha: sulfuric acid (H2SO4) + hydrogen peroxide ( H2O2)
- mask cleaning
Acid Etching
(Ask a staff member for these processes)
Back end :
![](https://www.ipcms.fr/wp-content/uploads/2021/01/micro-300x200-1.jpg)
Wire bonding
Hybond 626 semi-automatic gold wire bonder (wedge and ball bonding).
![](https://www.ipcms.fr/wp-content/uploads/2021/01/scriber-e1412610033876-225x300-1.jpg)
Scriber
Scriber for silicon wafers
![](https://www.ipcms.fr/wp-content/uploads/2021/01/D_SS10-high_sRGB-90x300-90x300-1.png)
Wafer dicing Machine
Semi-automatic Dicer MachineAcretech SS10 ModelSuitable for various types of materials and dimensions
Characterization :
![](https://www.ipcms.fr/wp-content/uploads/2021/01/afm-300x199-1.jpg)
- C-AFM : Conductive AFM
- PFM : Piezoreponse
- MFM : Magnetic Force Microscope
- nanolitho
Atomic Force Microscopy (AFM)
Atomic Force Microscope (Bruker Dimension Edge)..
![](https://www.ipcms.fr/wp-content/uploads/2021/01/microscope-300x200-1.jpg)
Optical Microscopy
Different microscopes are available to users for qualitative monitoring processes (like the Zeiss Axio Imager microscope equipped with a X100 lens)
![](https://www.ipcms.fr/wp-content/uploads/2021/01/Profilomètre-mécanique-3D-Dektak-Veeco-300x199-1.jpg)
Profilometer
The 3D Dektak mechanical profilometer (Veeco) can handle up to 6″ substrates. The stage is motorized one can make 3D mapping of the samples.
![](https://www.ipcms.fr/wp-content/uploads/2021/01/station-300x146-1.jpg)
4 Probes Station
arl Suss PM8 Probe Station (linked to a Keithley 2400 sourcemeter and Keithley 2100 digital multimeter). There’s also a Sheet Resistance Meter with Four Point Probe (Lucas Labs 302)
Microfluidic Lab :
![](https://www.ipcms.fr/wp-content/uploads/2021/01/microfluidicLab_human-300x200-1.jpg)
At STnano, we have a microfluidic lab. This dedicated area is equipped to realize PDMS replica on SU-8 mold. In this room one can find :
- a weigh and different tools
- a vacuum oven for PDMS degassing
- a plasma for surface activation
- a microscope to align the replica and the sample before sticking